Mentorpaper 101907 Image 5eb46d7a07c19

Fusing CMOS IC and MEMS Design for IoT Edge Devices

May 12, 2020
Accommodate single or multiple die techniques for successful IoT edge device design and verification.

Designers are now creating IoT edge devices that span across analog, digital, RF, and MEMS domains. They are tackling a challenge that once seemed impossible: combining the electronics of the device using the traditional CMOS IC flow with the MEMS sensor on the same silicon die. This paper reveals the secret of how designers accomplish this fusion.

Sponsored

Stricter guidelines imposed by version 3 of the IEC standard for harmonic current emissions push designers to embrace power-factor-correction methodologies.
The flyback topology is a versatile, widely used, switched-mode power-supply design with some interesting characteristics that brings performance and BOM advantages to many applications...
High output current, also referred to as Iout, might be an important spec for your low-dropout (LDO) linear regulator.
Designing power supplies that work from wall outlets has multiple challenges. This FAQ should answer many of your questions.