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Using Vias to Improve PCB Density

May 28, 2020
Rather than using numerous through-holes in a multi-layer PCB, designers have found that using blind and buried vias can tremendously increase routing density. Learn the best ways to design with vias in this whitepaper from Advanced Assembly.

The traditional method of increasing PCB density is to reduce the trace widths and their spacing. However, this can result in dielectric losses through thinner traces, and increased crosstalk from reduced spacing. Instead, designers have found the use of blind and buried vias increases the routing density tremendously.

In this whitepaper, you will learn:

  • Seven types of vias
  • Drilling microvias
  • Using vias with (BGAs) ball grid arrays
  • Via-in-pad designs


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