Using Vias to Improve PCB Density

The traditional method of increasing PCB density is to reduce the trace widths and their spacing. However, this can result in dielectric losses through thinner traces, and increased crosstalk from reduced spacing. Instead, designers have found the use of blind and buried vias increases the routing density tremendously.

In this whitepaper, you will learn:

• Seven types of vias
• Drilling microvias
• Using vias with (BGAs) ball grid arrays
• Via-in-pad designs