Five key workflows that deliver 3D IC packaging success
April 11, 2022
Several factors are converging and driving the chiplet design revolution. This paper explores these factors and outlines five key workflows that address and manage the associated, new challenges.
This paper recommends workflow adoption focus areas that provide immediate heterogeneous integration capability benefits while establishing a managed methodology adoption and migration process that minimizes disruption, risk, and cost. This will bring heterogeneous integration-based chiplet design within reach of the mainstream instead of being accessible only to the mega iDMs and fabless semiconductor companies.
Stricter guidelines imposed by version 3 of the IEC standard for harmonic current emissions push designers to embrace power-factor-correction methodologies.
The flyback topology is a versatile, widely used, switched-mode power-supply design with some interesting characteristics that brings performance and BOM advantages to many applications...
Power supplies are everywhere and there are a lot of options for designers. Knowing the differences can help in selecting one for a particular application.
