Proposed standardization of chiplet models for heterogenous integration
April 11, 2022
This paper proposes a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and power integrity, electrical properties, and test models to facilitate the integration of chiplets into a design.
In this paper, members of the Chiplet Design Exchange (CDX), propose a setof standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and power integrity, electrical properties, and test models, as well as documentation to facilitate the integration of the chiplets into a design. Additionally, security traceability assurance is an emerging need to ensure trusted supply chain and operational security of the chiplets and the resulting packaged devices. It is strongly recommended that these models are electronically readable for use in the design work flows.
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