Overcome the challenges of technology scaling and monolithic IC design process cost limitations. Download our new ebook on delivering 3D IC innovations faster:
One of the biggest semiconductor engineering challenges is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes. To overcome these challenges, more companies are turning to heterogeneous integration and the 3D stacking of ICs and specialized chiplets into 3D ICs. In heterogeneous designs, chips and chiplets are stacked and interconnected with vertical wiring. Designers can also combine them with 3D memory stacks, such as high bandwidth memory, on a silicon interposer within the package of a device.
Learn how to engineer a smarter future faster by downloading this ebook.
This presentation will provide an overview on proper fan selection, including system profiling, determining a system’s cooling requirements, and an outline of fan types and features...
This video delves into the basics of ultrasonic sensors, including how they work, understanding beam angles, a comparison of strengths and limitations, and more.
In this podcast episode, we interview Joe Pawelczyk, VP of operations at DPI UAV Systems (USA), a leading provider of small rotary wing unmanned aerial vehicles (UAV).
