Flash memory has become the dominant storage solution from micros to the cloud. Meeting the capacity and performance needs has pushed the envelope in size, latency and reliability. The latter has become more challenging as increased density and power has led to higher power dissipation and the need for better thermal management. This is especially true for small form factor storage solutions like M.2 E1.S and CFexpress. The use of high speed serial interfaces like PCI Express (PCIe) to support standards like NVMe allow higher performance systems to operate but this only works if the storage system continues to operate efficiently.
Overheating can reduce system lifetimes, result in the loss of data or system integrity or even making the storage device inoperable. Thermal runaway is possible with poorly designed systems. This makes thermal dissipation a primary design requirement. This whitepaper addresses these issues and their solutions allowing developers to deliver higher performance, higher capacity flash memory systems that will operate effectively within the limits of the desired form factors.
