MOSFET Packaging Results In Smaller Eight-Pin Devices

    July 1, 2002
    Reporting a 30% smaller footprint than six-pin VS-6 devices, the VS-8 eight-pin, surface-mount package for power MOSFETs measures just 0.85-mm thick. Currently available packages are said to measure 1.1-mm thick. The new package occupies an area of

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    Reporting a 30% smaller footprint than six-pin VS-6 devices, the VS-8 eight-pin, surface-mount package for power MOSFETs measures just 0.85-mm thick. Currently available packages are said to measure 1.1-mm thick. The new package occupies an area of 5.15 mm2 and measures 1.9 mm x 2.9 mm. In addition to tight dimensions, the VS-8 promises improved power dissipation in the order of 2.5W at t

    Company: TOSHIBA AMERICA ELECTRONIC COMPONENTS INC.

    Product URL: Click here for more information

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