Power MOSFET Pairs Ribbon Bonding And SMT Package

Oct. 8, 2008
Emerging as the first discrete power MOSFET to combine ribbon bonding with the company’s surface-mount PowerSO-10 package, the 250A STV250N55F3 specifies a typical on-resistance of 1.5 milliOhms and the package dissipates 300W at 25?C. Groomed

Emerging as the first discrete power MOSFET to combine ribbon bonding with the company’s surface-mount PowerSO-10 package, the 250A STV250N55F3 specifies a typical on-resistance of 1.5 milliOhms and the package dissipates 300W at 25?C. Groomed for applications up to 55V, the device operates at temperatures up to 175?C. These capabilities makes the STV250N55F3 suitable for use in high-current electric-traction applications such as forklift trucks, golf carts and pallet trucks, lawnmowers, wheelchairs, and electric bikes. In the future, the device will become eligible for automotive-grade applications. Available this quarter, price is $2.50 each/10,000. STMICROELECTRONICS, Lexington, MA. (888) 787-3550.

Company: STMICROELECTRONICS

Product URL: Click here for more information

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