High-Density Board-to-Board Connectors Fit in Tight Spaces

Aug. 25, 2022
A series of quad-row board-to-board connectors use staggered pins to save 30% more space compared to existing solutions.

This video is part of our TechXchange Talks Series.

Molex has introduced a new series of Quad-Row Board-to-Board Connectors that it hopes will set "a new connectivity standard for space optimization" by saving 30% more space compared to existing designs.

The connectors feature a unique layout that staggers the position of the pins across four rows, with a signal contact pitch of 0.175-mm, to deliver high-density circuit connectivity. At the same time, the parts align with a 0.35-mm soldering pitch that's standard for surface-mount technology (SMT).

The goal is to give consumer electronics firms more flexibility when it comes to designing smartwatches, augmented-reality (AR) devices, and other wearables. To discuss the technology in-depth, Electronic Design met with Kenji Kijima, director of mobile solutions at Molex.

Check out more TechXchange Talks videos here.

About the Author

James Morra | Senior Editor

James Morra is a senior editor for Electronic Design, covering the semiconductor industry and new technology trends, with a focus on power management. He also reports on the business behind electrical engineering, including the electronics supply chain. He joined Electronic Design in 2015 and is based in Chicago, Illinois.

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