Connector Solution for Future-Proof End-to-End 25 Gbps Channel Interoperability

March 13, 2012
Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, Molex Inc. offers a comprehensive portfolio of end-to-end high-speed channel solutions for increased data rates with minimal crosstalk and maximum signal integrity in mobile telecom and data communications storage and networking applications.

Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, Molex Incorporated offers a comprehensive portfolio of end-to-end high-speed channel solutions for increased data rates with minimal crosstalk and maximum signal integrity in mobile telecom and data communications storage and networking applications.

A typical channel for a high-speed network connection could start with zSFP+ (Small Form-factor Pluggable Plus) SMT I/O connectors receiving data (e.g., a signal) entering into the switch chassis. Enhanced zSFP+ 20-circuit connectors deliver superior performance in high-speed telecom and data communications equipment. Designed for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the scalable Molex zSFP+ interconnects provide optimal EMI and signal integrity. The signal could next route to a motherboard through a SEARAY† board-to-board mezzanine connector. Traveling at data rates of up to 25Gbps, the signal could pass through the midplane and daughtercard via Impact™ Orthogonal and EdgeLine® CoEdge connectors. Designed for a direct PCB connection, the Impact 100-Ohm orthogonal direct right-angle male connector and daughtercard system mitigates the performance constraints of backplane and midplane connections. The space-saving Impact technology supports high-speed 25 Gbps data rates and greatly reduces airflow restrictions, cross-talk, and capacitance constraints in high-speed channels.

The EdgeLine CoEdge connector offers a low profile height interconnect solution that creates minimal wind resistance in an air-cooled chassis and an electrically optimized terminal to minimize noise for high speed transmissions in excess of 25Gbps. This scalable and cost-effective, one-piece EdgeLine connector allows designers to specify first-mate, last-break designations and shorter stubs for high-speed communications using a customizable card-edge interface.

As the signal exits the daughtercard, a zQSFP+ integrated cage and connector routes it through to a zQSFP+ breakout cable and into a router/switch. Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, the Molex zQSFP+ interconnect solution provides 28 Gbps data rates for up to 4km with excellent thermal cooling, signal integrity, EMI protection and the lowest optical power consumption in the industry.

Once at the router, a NeoScale™ 28 Gbps mezzanine connector could direct the signal to the motherboard and into the backplane to another Impact solution, so the signal is delivered quickly and cleanly. One of the highest performing mezzanine connections on the market, the recently launched Molex NeoScale mezzanine connector features a unique and patent pending triad design to group signals into electrically optimized structures

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