Wire-to-Board Connector Series Reduces Mounting Area 30%

Hirose has developed the DF63 connector, a robust wire-to-board connector that combines small size with high-current capacity and high reliability.

Oct. 2, 2014

2 min read

The DF63 connector from Hirose is a robust wire-to-board connector that combines small size with high-current capacity and high reliability. Featuring a 3.96 mm pitch, the DF63 Series connector provides a high current rating of up to 15 A and is suitable for use with #16 to #18 AWG wire. Current capacity varies with pin count and wire size. This compact DF63 Series connector features up to 30% reduction in occupied board area compared to competing products.

The rugged crimp contact system with multi-contact points increases reliability and performance. The clear tactile and audible click during engagement ensures complete mating. Its locking structure provides strong retention with a minimum locking strength of 35 N for demanding applications. The center position lock system and keying options allow side-by-side mounting to reduce overall package size. The DF63 also features individual contact silos that make the connector finger-safe in operation.

This series is available in straight, right-angle and in-line variations ranging from 1 to 6 contact positions (right-angle and in-line variation being available in late 2014). The DF63 is also suitable for potting or resin sealing up to a 5mm high.

The small size and high durability of the DF63 Series wire-to-board connector makes it well-suited for a wide range of applications including industrial machinery, industrial robotics, medical devices, networking equipment/servers, smart meters, home electronics, white goods, office equipment and gaming equipment.

The DF63 Series is RoHS compliant and UL and TÜV certified. With an operating temperature range of -35 °C to +105 °C, the DF63 limits contact resistance under 10m ohms maximum, and has an insulation resistance of 1000M W minimum at 500 Vdc.