Interconnections & Packaging: Low-Profile VRM Connector Suits 1U Server Applications

Feb. 2, 2004

The iCool low-profile VRM connector enables the use of vertical voltage-regulator modules (VRMs) in 1U servers, both VRM 10.0 and 10.2 types. It also fits small-form-factor PCs and workstations. The connector handles up to 130 A in 4.0-in. connectors and comes with a through-hole or surface-mount solder attachment. Integral latches with a reverse angle-latch lock ensure that the VRM is secure during shock testing. Features include 20 signal contacts for VR control, four fork locks, and selectively gold-plated contacts. Optional 2U server versions for up to 60°C ambients are also available. Lead times are six to eight weeks.

Molex Inc.www.molex.com; (630) 969-4550

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.