Innovative Packaging Technology Aims At Miniaturized Devices

Sept. 17, 2006
Freescale Semiconductor has developed a new packaging technology that could replace BGA and flip chip as the dominant packaging and assembly approach for highly-integrated semiconductors...

Freescale Semiconductor has developed a new packaging technology that could replace BGA and flip chip as the dominant packaging and assembly approach for highly-integrated semiconductors. Redistributed chip packaging (RCP) offers impressive flexibility and integration density, characteristics that help deliver 30% smaller packaged semiconductor devices versus traditional ball-grid array (BGA) technology.

RCP integrates semiconductor packaging as a functional part of the die and overall system. It addresses some of the limitations associated with previous generations of packaging technologies by eliminating wire bonds, package substrates, and flip chip bumps. In addition, RCP does not utilize blind vias or require thinned die to achieve thin profiles. These advancements simplify assembly, lower costs, and provide compatibility with advanced wafer manufacturing processes utilizing low-k interlayer dielectrics.

The technology is easily adapted for 3G mobile phones and a broad range of consumer, industrial, transportation, and networking devices that can benefit from the consolidation of electronic components into a single, miniaturized system. In fact, RCP’s flexibility makes it a virtually universal package technology useful across a large number of applications and materials. It is compatible with advanced assembly technologies such as System in Package (SiP), Package on Package (PoP), and integrated cavity packages.

Using RCP and PoP technology, Freescale has fabricated a radio-in-package that measures less than 25 by 25 mm. The radio-in-package contains all of the electronics required for a 3G mobile phone including memory, power management, baseband, transceiver, and RF front-end modules.

Lead-free and RoHS compliant, RCP meets reliability standards for commercial and industrial applications. Development and tests are in progress for automotive applications.

Freescale maintains a large portfolio of intellectual property specific to RCP technology. The company expects to offer products utilizing RCP technology by 2008. Freescale intends to initially use RCP in its wireless product families.

Freescale Semiconductor
www.freescale.com

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