Flash-Memory Parts Trim Height To 0.2 mm

Jan. 20, 2003

SILICON STORAGE TECHNOLOGY has come up with what may be the thinnest and—in most densities—the smallest footprint form-factor memory parts for demanding next-generation Bluetooth applications, which typically restrict device heights...

Roger Allan

SILICON STORAGE TECHNOLOGY has come up with what may be the thinnest and—in most densities—the smallest footprint form-factor memory parts for demanding next-generation Bluetooth applications, which typically restrict device heights to 2 mm. Its ball-grid-array (BGA) and land-grid-array (LGA) Micro-Packages use proprietary packaging materials and careful wafer back grinding. As a result, the height of the XFLGA part with bump pads stands at just 0.52 mm in a 48-contact, 4- by 6-mm footprint. The WFBGA version has the same features, save a 0.73-mm height and ball pads. Both are rated for operation from −40°C to 85°C.

SST credits its NOR-type SuperFlash with split-gate cell architecture for this development. "With our technology, we can achieve smaller sectors without significantly increasing die size," says Ben Cheung, product marketing manager for the Standard Memory Product Group. "This is important for a fabless company like SST because SuperFlash's thicker oxide is more compatible with a standard logic process. This in turn means lower costs and higher reliability, especially for data retention."

Samples of both 3.3-V parts are available in 4- and 8-Mbit x16 densities. Their 0.5-mm contact pitch suits them for pinouts up to 32 Mbits. The XFLGA's thin height isn't that much thicker than a bare die, yet it costs less. SST expects the 4-Mbit version to cost about $1.50 to $1.60 in lots under 10,000 units.

Silicon Storage Technology Inc.
www.sst.com
(888) SST-CHIP, (408) 735-9110

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About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.