Thermal Gap Filler Pads Adhere To Shapes And Sizes Of Components

Said to easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas, this new line of high heat conduction gel pads are available in different constructions, including with mesh reinforcement. The gel pads are designed to eliminate the thermal impedance of devices mounted on substrates or at heatsink junctions, thereby yielding higher temperature transfer gradients. They come in sheets for die-cutting in thicknesses from 0.5 to 5.0 mm.