Interconnections & Packaging: Spring-Loaded Contacts Come In Low Profiles, Double Rows

March 1, 2004

Ultra-low-profile spring-loaded contacts as well as double-row contacts on carrier tape have been added to the 811 series of contacts. The 811 series features contacts on 0.100-in. grids in eight heights from 0.137 to 0.295 in. supplied in single-row and double-row contact strips. Double-row (813 series) strips are available on 32-mm wide carrier tape with four through 16 positions (two by two and two by eight). Current ratings are 2 A continuous and 3 A peak. Precision-machined piston/base and gold-plated components ensure a minimum cycle life of 100,000 minutes. These contacts are priced at $0.716 each in quantities of 5000 units. Lead time is within seven days.

Mill-Max Manufacturing Corp.www.mill-max.com; (516) 922-6000, ext. 211

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.