Tacky Flux And Lead-Free Solder Target Flip-Chip Assembly

TF33, TF35 and TF37 Series tacky flux is well-suited for bumped die attach as well as BGA applications. This flux offers a very high green strength, an 8-hour working life, and will reflow and leave a clear residue. The flip-chip tacky flux, which meets all Bellcore and IPC requirements, is available in low and high activation versions, and in low and ultra-low residues. And it can be dispensed from a syringe or applied using a drum fixing method. Additionally, F365Cu0.5-89M3 no-clean solder paste is mixed with a lead-free alloy to provide superior performance on a variety of surface finishes including HASL, OSP and others. The paste use an Sn/Ag/Cu alloy and has a melting temperature of 217°C.