QFN Socket Supports 0.5-mm Pitch Chips

Oct. 8, 2008
Housing STATSChipPAC QFN packages without significant performance loss and with a minimal increase in PCB footprint, the SG-MLF-7025 socket accommodates devices with a 0.5-mm pitch and a 10-mm package size. The component operates at bandwidths up to

Housing STATSChipPAC QFN packages without significant performance loss and with a minimal increase in PCB footprint, the SG-MLF-7025 socket accommodates devices with a 0.5-mm pitch and a 10-mm package size. The component operates at bandwidths up to 10 GHz with an insertion loss of less than 1 dB. Stock, it can safely dissipate several Watts of power and up to 100W with a custom heat sink. Typical contact resistance is 23 milliOhms per pin and the socket connects all pins and the optional center power pad with a 10+ GHz bandwidth on all connections. Other specs include an operating temperature range from -35°C to +100°C, a pin inductance of 10.15 nH, and a capacitance to ground of 0.10 pF. Additionally, an open lid allows probing of the die or direct injection of heat or cooling air. Single-unit price is $508. IRONWOOD ELECTRONICS, Burnsville, MN. (800) 404-0204.

Company: IRONWOOD ELECTRONICS

Product URL: Click here for more information

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