Interconnections & Packaging: 19-in. Cabinet Enclosures Provide Aesthetic Styling

March 1, 2004

Cost-effective 19-in. cabinets now come with aesthetic styling in addition to high durability and versatility. The full-size Eurorack and mid-size Minirack series cabinets are well suited for packaging electronics in a variety of applications. They incorporate self-supporting inner-frame construction with an aluminum die-cast top and bottom bolted to four extruded aluminum uprights. The cabinets in the Eurorack series can hold up to 880 lb (399 kg), while the Minirack cabinets hold 440 lb (200 kg). All cabinets meet ANSI/EIA RS 310-D standards and can be assembled to order. Pricing starts at $900 for the Eurorack series and $400 for the Minirack series. Lead time is two to three weeks.

Schroff Productswww.schroff.us.com; (888) 550-9543

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.