Polymer Coating Transforms Substrates Into EMI/RFI Shields

Feb. 1, 2001
This unique polymer coating claims to turn practically any material into a solderable and electronically conductive substrate. The formulation contains a metallic component that has a magnetic and electronic conductivity properties that transforms the

This unique polymer coating claims to turn practically any material into a solderable and electronically conductive substrate. The formulation contains a metallic component that has a magnetic and electronic conductivity properties that transforms the coated substrate into an EMI/RFI shield. HumiShield can be applied to materials such as metal, ceramic, glass, paper and most plastics. Once applied and properly cured, the coating is conductive and is ready for soldering, electroplating or painting. HumiShield may be applied by spraying, dipping, screening or brushing.

Company: HUMISEAL - Division of Chase Corporation

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!