Processor Socket Packs Top POP Memory

Oct. 8, 2008
In a two level, stacked configuration, the SG-BGA-7116 processor socket handles a 0.4-mm BGA with a 12 mm x 12 mm body size with a 28 x 28 ball array to the target PCB. It also provides a POP memory socket on top handling a 12 mm x 12 mm, 0.5-mm pitch

In a two level, stacked configuration, the SG-BGA-7116 processor socket handles a 0.4-mm BGA with a 12 mm x 12 mm body size with a 28 x 28 ball array to the target PCB. It also provides a POP memory socket on top handling a 12 mm x 12 mm, 0.5-mm pitch device with a 23 x 23 array and a Samsung 12 mm x 12 mm, 168-ball fine pitch ball grid array package. The component operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss and is capable of dissipating up to several Watts without extra heat sinking and can handle more with a custom heat sink. Contact resistance is typically 100 milliOhms per pin. Other specs include an operating temperature range is from -40°C to +100°C, a pin self inductance of 0.11 nH, mutual inductance of 0.028 nH, capacitance to ground of 0.028 pF, and a current capacity of 5A per pin. Single-unit pricing for the SG-BGA-7116 is $2,549. IRONWOOD ELECTRONICS, Burnsville, MN. (800) 404-0204.

Company: IRONWOOD ELECTRONICS

Product URL: Click here for more information

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