The EP51N is a two-component nickel-filled conductive epoxy resin system for high performance structural bonding and sealing. Its resin is formulated with a 1:1 non-critical-mix ratio by weight or volume and cures in as little as 5 minutes at ambient temperatures. The cured polymer offers a tensile lap-shear strength of more than 1000 psi with an electrical resistivity as low as 5 to 10 ohm/cm2 measured at 75°F. Service temperature ranges from -60°F to 250°F.
Company: MASTER BOND INC.
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