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    1. Technologies
    2. Components
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    Gap Filler Material Provides Thermal Relief

    June 1, 1999
    The effective transfer of heat from components into various heat-spreading devices is handled by THERM-A-GAP F574 thermally conductive elastomer. The material fills air gaps between hot-running components, such as microprocessors, video chips and

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    The effective transfer of heat from components into various heat-spreading devices is handled by THERM-A-GAP F574 thermally conductive elastomer. The material fills air gaps between hot-running components, such as microprocessors, video chips and power devices, and their heat spreaders. Requiring no mounting adhesive, the material consists of a soft silicon elastomer. Standard sheets are 9" x 9".

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