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    Electronicdesign Com Products Components Epoxy Dissipates Heat19036
    1. Technologies
    2. Components
    3. Interconnects

    Epoxy Dissipates Heat

    Dec. 1, 1999
    A two-component, ceramic-filled, thermally-conductive, electrically-insulative epoxy resin, EP51AO is a bonding, sealing and potting material for assemblies. The compound cures rapidly at ambient temperatures with a one-to-one mix ratio, weight or
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    Electronicdesign Com Products Components Epoxy Dissipates Heat19036
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    A two-component, ceramic-filled, thermally-conductive, electrically-insulative epoxy resin, EP51AO is a bonding, sealing and potting material for assemblies. The compound cures rapidly at ambient temperatures with a one-to-one mix ratio, weight or volume. After mixing, the EP51AO gels in as little as 5 minutes and cures fully within 2 hours at ambient temperature. The cured epoxy exhibits high physical strength along with thermal conductivity of 8 Btu/hr./ft.2/°F/in. at 75°F. It is an excellent electrical insulator with an electrical volume resistivity exceeding 1012 ohms/cm. Service temperature range is -65°F to >250°F.

    Company: MASTER BOND INC.

    Product URL: Click here for more information

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