Packaging/Interconnects: Adapter For MLF/QFN IC Packages Provides Quick Prototyping

Dec. 4, 2003
Design engineers using 0.5-mm pitch 48-position MLF/QFN packaged ICs will be interested in the PA-MLF48A-P-Z-02 adapter, which provides high-performance quick prototyping. It comes with a clam-shell ZIF socket for easy access to all signals and...

Design engineers using 0.5-mm pitch 48-position MLF/QFN packaged ICs will be interested in the PA-MLF48A-P-Z-02 adapter, which provides high-performance quick prototyping. It comes with a clam-shell ZIF socket for easy access to all signals and simplified IC swapout. It interfaces the 48-position MLF/QFN ZIF socket to a 0.100-in. center pin-grid array (PGA). The adapter is constructed with gold-plated solder-tail machined pins for maximum reliability when the adapter is socketed. It can be supplied optionally with wire-wrap pins for inexpensive wire-wrap panels. The adapter is available from stock at $450 each in lots of one to 10 units.

Ironwood Electronicswww.ironwoodelectronics.com; (800) 404-0204
About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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