New specialized techniques have been developed for photochemically outlining polyimide and the adhesive systems used to fabricate flexible circuits. The photochemical outlining process produces an edge completely free of slivers, nicks or burrs, and allows windowed leads and back side access. For high current applications, the firm's PowerFlex process can be used to produce copper traces up to 0.020" thick. The firm has the capabilities for producing multi-layer, fine-line and adhesive-less flex circuits, micro-vias, beryllium-copper conductors and cantilevered leads.
Company: TECH-ETCH INC.
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