Flex Circuits Tap New, Performance-Enhancing Techniques

Oct. 1, 1999
New specialized techniques have been developed for photochemically outlining polyimide and the adhesive systems used to fabricate flexible circuits. The photochemical outlining process produces an edge completely free of slivers, nicks or burrs, and

New specialized techniques have been developed for photochemically outlining polyimide and the adhesive systems used to fabricate flexible circuits. The photochemical outlining process produces an edge completely free of slivers, nicks or burrs, and allows windowed leads and back side access. For high current applications, the firm's PowerFlex process can be used to produce copper traces up to 0.020" thick. The firm has the capabilities for producing multi-layer, fine-line and adhesive-less flex circuits, micro-vias, beryllium-copper conductors and cantilevered leads.

Company: TECH-ETCH INC.

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!