Packaging & Interconnects: High-Power Pin/Sleeve Connection Devices Go Industrial

March 31, 2005

The models in a new line of high-power inlets and outlets have been rated per IP 44-67 standards for dust and water splashing. They're designed for connection to equipment rated from 16 to 32 A of service at 120 to 250 V ac for panel or cable mounting. These pin and sleeve connection devices can be configured with three-pin 16/20-A or 30/32-A ratings in yellow or blue colors with four- and six-hour ground-pin positions. Pricing starts at $16.47. Models also are available with four-pin 20- to 125-A ratings in orange, blue, or red with nine- and 12-hour ground-pin positions. Pricing starts at $24.71. Models with five-pin 20- to 124-A ratings in blue or red with six- and nine-hour ground-pin positions start at $22.18 each.

Interpower Corp.www.interpower.com; (800) 662-2290

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.