Packaging & Interconnects: Card Edge Connectors Get Aboard PCI Express

Feb. 3, 2005

Recently released straddle-mount card edge connectors support high-speed serial PCI Express applications. They're available for one, four, eight, or 16 PCI Express lanes to match different bandwidth requirements. Each lane comprises differential transmit and receive signal pairs that support 2.5-Gbit/s data rates in each direction. Each connector's card accepts a 1.58-mm thick add-in card. Edge contacts are spaced on 1.0-mm pitches. A molded polarization key on the connector and a corresponding notch on the add-in card prevent improper insertion. Pricing for the series 10025026 connectors ranges from $1.74 to $3.54 each in quantities of 1000 units. Lead time is stock to five weeks.

FCI Electronicswww.fciconnect.com; (800) 237-2374

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.