Metal-Matrix Composite Delivers Advanced Thermal Management

Oct. 28, 2004

Engineers can now tailor their thermal-management, packaging, and interconnection needs with a low-cost, metal-matrix composite material made of aluminum, silicon, and carbon (AlSiC). The material's isotropic thermal coefficient of expansion (CTE), which includes 8.75, 10.56, and 11.7 for AlSiC-9, -10, and -11, respectively (from 30°C to 200°C), can be adjusted for specific applications by modifying the aluminum-metal/SiC ratio. This eliminates the need for thermal-interface stacking, increasing field reliability.

The material, developed by CPS Corp., features a high level of thermal conductivity of 200, 200, and 100 W/mK for AlSiC-9, -10, and -11, respectively, at 25°C, for highly efficient thermal dissipation. Specific heat ratings of the three composite materials are 0.741, 0.786, and 0.808 J/gK, respectively, at 25°C. This, combined with the high CTE and conductivity ratings, prevents the bowing and flexing of packaging and substrate materials that can lead to failure. Other features include respective densities of 3.01, 2.96, and 2.89 (g/cm³) and a respective Young's modulus of 188, 167, and 167 GPa.

The AlSiC composite's near- and net-shaped fabrication process produces the composite material and fabricates the product's geometry. This results in a cost-effective product and enables rapid prototyping for high-volume advanced thermal management. Its unique casting process permits the integration of very high thermal-conductivity inserts (over 1000 W/mK) or cooling tubes for more advanced thermal management.

According to CPS, because the performance of the material varies greatly depending on how it's customized, prices can range from $5 to $30 per unit. The material is available now.

CPS Corp.www.alsic.com
(508) 222-0614, ext. 42

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.