Interconnections & Packaging: Ferrite-Chip-Bead Array Houses Four Beads In One Package

Feb. 2, 2004

The PMA series of surface-mount multilayer ferrite-chip-bead arrays features four ferrite beads in a single package measuring just 3.2 by 1.6 by 0.9 mm, allowing the handling of four separate lines simultaneously. The arrays especially suit miniature telecom devices and portable computer equipment. Performance includes an impedance range of 30 to 100 (omega), a dc current range of 100 to 350 mA, and an operating-temperature range of −55°C to 125°C. Terminals are solder-coated for wave and reflow soldering. The series is offered in Type L for low-frequency and Type H for high-frequency applications. Arrays come in tape-and-reel packaging and cost from $0.025 each in production quantities. Delivery is four to six weeks.

J.W. Millerwww.jwmiller.com; (310) 515-1962

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.