Packaging/Interconnects: Interconnect Line Expanded To Include Many I/O Interfaces

April 12, 2004

A new line of interfaces includes the DSM D subminiature units in three different tail setbacks. These interfaces come in through-hole and surface-mount (SMT) configurations and right-angle and vertical styles. Average price is $0.75 to $1. Modular jacks are available in through-hole and SMT configurations with single-port (MODS) and multiport (MODM) styles. Average price is $0.30 to $0.40 per port. High-speed sockets include A type and B type USB units and plugs (USB), mini USB (MUSB), and six- and nine-pin Firewire (FSB) and Digital Visual Interface (DVI) units. Average price is $0.40 to $0.50. Mini DIN (MDIN) interfaces range from three to nine positions with single- and dual-port styles. Average price is $0.40 to $0.50.

Samtec Inc.www. samtec.com (800) SAMTEC-9

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.