Packaging, Materials & Interconnects: Custom-Colored Modular Jacks Avoid Mismating

Nov. 15, 2004

The models in a new line of modular jacks can be customized to match the color of a cable assembly, preventing mismating and increasing design flexibility. Colors include orange, green, blue, gray, yellow, and black. A right-angle version with an ultra-low profile, a surface-mount (SMT) version, and an inverted version with a top-latch jack are available. All three meet different design requirements, offering flexibility at an affordable cost. Pricing per thousand in 25,000-piece lots is $363.90 for the right-angle version, $463.40 for the SMT version, and $332.70 for the inverted version. Lead time is three to four weeks.

Molex Inc.www.molex.com; (630) 527-4415

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.