Packaging, Materials & Interconnects: RF Center Probe Test Socket Suits 1- To 10-GHz Packages

Nov. 15, 2004

A molded RF center probe test socket for devices from 1 to 10 GHz accepts devices from 25 to 55 mm2 wide. It's ideal for manually testing devices with pitches down to 0.50 mm and in packages like CSPs, MicroBGAs, and LGAs, as well as...

Roger Allan

A molded RF center probe test socket for devices from 1 to 10 GHz accepts devices from 25 to 55 mm² wide. It's ideal for manually testing devices with pitches down to 0.50 mm and in packages like CSPs, MicroBGAs, and LGAs, as well as SRAM, DRAM, and flash ICs. A signal path of only 1.95 mm achieves minimal signal socket loss. Estimated contact life is over 500,000 cycles. Contact self-inductance is 0.51 nH. Socket contact forces are 9 to 12 g per contact for 0.8-mm pitches and larger. The operating temperature ranges from 55°C to 150°C. Price for a 2.4-GHz molded 415-lead socket starts at $1122, and lead time is six weeks.

Aries Electronicswww.arieselec.com; (908) 996-3891

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.