Packaging & Interconnects: Plastic DIN Rail Enclosures Suit Industrial Control Applications

Nov. 29, 2004

The DB series of DIN rail mount enclosures satisfies a variety of industrial applications. It includes eight different sizes with 10 to 30 contacts, in widths from 0.87 to 5.91 in. All of the enclosures snap onto a standard DIN rail, and two of them can be screw-mounted to a panel. Two others have a choice of 12- or 24-tiered contacts, similar to a terminal block. The rest have two in-line rows of contacts per box. All of the enclosures have internal card guides. The front covers include an area for labels or decals. The enclosures' ABS plastic housings are rated for UL94V-0 flammability. Contacts can handle 10 A. They cost $12.90 to $23. Availability is from stock.

Bud Industries Inc.www.budind.com; (440) 946-3200

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.