Component Suppliers for the iPhone 3G Based on Physical Teardown
Preliminary Table provided by iSuppli Corp.
| Supplier | Component Description |
| Source Unidentifiable | Display |
| Source Unidentifiable | Touchscreen |
| Toshiba Semiconductor | NAND Flash Memory, 8 GBbyte |
| Infineon | Baseband: HSDPA/WCDMA/EDGE, Dual ARM926 & ARM7Core |
| Samsung Semiconductor | Application Processor |
| Source Unidentifiable | Camera Module |
| Micron Technology | Image Sensor: 2 Megapixel; CMOS |
| Murata | Contains Marvell 88W8686 WLAN; CSR BC6 ROM Bluetooth |
| Samsung Semiconductor | SDRAM: Mobile DDR, 1 Gbit |
| Source Unidentifiable | Battery |
| Infineon | RF Transceiver: Quad-Band GSM/EDGE, Tri-Band WCDMA/HSDPA, 130-nm RF CMOS |
| Numonyx | 128-Mbit NOR Flash; 64-Mbit pSRAM |
| Infineon | GPS Receiver: Single Chip |
| Infineon | Power Management IC: Phone |
| NXP Semiconductors | Power Management IC: Applications Processor |
| Broadcom | Multitouch Controller |
| Wolfson Microelectronics | Audio Codec |
| Skyworks | Power Amplifier: Quad-Band GSM/EDGE |
| STMicroelectronics | Accelerometer: Microelectromechanical |
| TriQuint Semiconductor | Power Amplifer Module (PAM): WCDMA/HSUPA |
| TriQuint Semiconductor | PAM: WCDMA/HSUPA |
| TriQuint Semiconductor | PAM: WCDMA/HSUPA |
| National Semiconductor | Mobile Pixel Link: 24-Bit RGB Display Interface Serializer |
| Linear Technology | Battery Charger: USB Compatible |
| Linear Technology | DC-DC Converter - Synchronous Boost |
| Infineon | Amplifier: LNA, Tri-Band HSDPA |
| Silicon Storage Technology | Flash: NOR, 8 Mbit |
| Infineon | Amplifier - LNA, GPS |
| Linear Technology | Regulator: Switching |
| Maxim | Analog IC |
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