3D Integration Process Enables Flexible Electronics
Technologists from IMEC and its associated laboratory at Ghent University unveil a unique 3D integration process enabling flexible electronic systems with a thickness of less than 60 micrometers.
Technologists from IMEC and its associated laboratory at Ghent University unveil a unique 3D integration process enabling flexible electronic systems with a thickness of less than 60 micrometers.
The ultra-thin chip package technology allows the integration of complete systems in a conventional flex substrate, paving the way to low-cost, unobtrusive wearable electronics such as devices for health and comfort monitoring. The chip is first thinned down to 25 microns and embedded in a flexible ultra-thin chip package. Next, the package is embedded in a standard double-layer flex PCB using standard flex production techniques.
After embedding, other components mount above and below the embedded chip, leading to a high-density integration.