Tape Bonds Heat Sinks To Plastic ICs

The task of bonding heat sinks onto plastic IC packages is made easy with ThermAttach T410 thermally-conductive, double-sided adhesive tape, available in standard roll sizes of 6" wide by either 100' or 400' long. The thermal tape features a silicone-based pressure sensitive adhesive on one side of a 0.002" aluminum foil carrier. This adhesive is said to bond more securely to plastic packages than do acrylic-based tapes, whose surfaces often contain traces of silicone mold release agents.The tape's other side, a thermally-loaded, high bond-strength acrylic PSA, bonds securely to metal heat sinks. Applications include bonding heat sinks to molded BGA packages.