Epoxy Gives Clear, Low-Stress Pottings

Feb. 1, 1999
Capable of maintaining its clarity both before and after curing, EP-EK 301-2FL two-component, optically-clear epoxy encapsulant and potting compound is well-suited for use where stress-sensitive properties are paramount to the component or device

Capable of maintaining its clarity both before and after curing, EP-EK 301-2FL two-component, optically-clear epoxy encapsulant and potting compound is well-suited for use where stress-sensitive properties are paramount to the component or device being bonded, coated or potted, including potted fiber-optic bundles in ferrules and large core glass fibers in connectors. This low-viscosity epoxy has an 8-hour pot life, may be cured at room or elevated temperatures, and exhibits no loss of adhesion or decoupling when subjected to five days at 95% relative humidity and 30°C to 60°C temperatures per MIL-STD 810E.

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