SMT IC Packages Are ESD Safe

For users of surface-mount components, ChipSafe/SMT family of album packaging products is for ESD-safe handling of IC products. The family includes three sizes of storage albums, a variety of multiple sized sample trays, mailer packaging for shipping and transport and a binder insert, archival system. Every product in the system uses one or more of four standard inserts to safely hold any SMT IC component. Formed from non-corrosive, solvent resistive, non-sloughing static-dissipative foam, the inserts protect all architectures, form factors, styles and sizes of SOIC, LCC, QFP, BGA products as well as DIP outlines.