Die Attach Adhesive Is Highly Thermally Conductive

Used in die attach applications where electrical insulation combined with superior thermal performance is required for laminate, ceramic and metal substrates, QMI 536HT highly thermally conductive adhesive is well-suited for heatsink and lid attach to flip chips as well as traditional die attach uses. The adhesive is formulated using the proprietary liquid bismalemide monomer and other resin additives and boron nitride filler to achieve thermal conductivity in excess of 0.7 W/(mK). This 100% solids adhesive can be quick oven cured at temperatures down to 125°C. The adhesive produces a defect-free layer that absorbs very little moisture, retains adhesion during JEDEC Level 1 exposure and has a dielectric constant of 3.5.