A one-part diamond-filled epoxy adhesive with ultra high thermal conductivity, SUPERTHERM 2003 is for use in microelectronics applications where superior thermal properties coupled with electrical insulation are required. After the high temperature
A one-part diamond-filled epoxy adhesive with ultra high thermal conductivity, SUPERTHERM 2003 is for use in microelectronics applications where superior thermal properties coupled with electrical insulation are required. After the high temperature cure, this epoxy has superior adhesion to numerous substrates such as glass, silica, alumina, metals and plastics.
