SMT/BGA Rework System Incorporates FIR Technology

March 1, 2003
The company’s latest system incorporating the Focused Infra-Red (FIR) rework system technology replaces its Lightmaster model. Hands free and semi-automatic, the IR-X400 FIR rework system boasts the levels of profiling and process control

The company’s latest system incorporating the Focused Infra-Red (FIR) rework system technology replaces its Lightmaster model. Hands free and semi-automatic, the IR-X400 FIR rework system boasts the levels of profiling and process control necessary for the effective rework of advanced packages, including SMDs, BGAs, µBGAs, CSPs and Flipchips. The IR-X400 combines its FIR heating system with a Dual Zone IR PCB pre-heater, with independent component and PCB closed loop temperature control. The rework system is equipped with a new advanced digital controller combined with the ThermoActive V3 software. Standard features include a precision component pick-up, macro-micro Z-axis with rotation, and a precision X/Y table with accurate macro/micro movement. Optional features include the CCTV split-beam prism-based alignment system and additional lenses covering any component combination. PDR SMT/BGA REWORK SOLUTIONS, Sacramento, CA. (877) 700-6085.

Company: PDR SMT/BGA REWORK SOLUTIONS

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!