Flip-Chip Capillary Underfill Promotes Lead-Free Assembly

Hysol FP4547FC debuts as the market's first capillary flip-chip underfill to be compatible with clean and no-clean flux residues, thereby facilitating lead-free assemblies. The product promises to protect lead-free, flip-chip devices and allow them to meet JEDEC Level 3/260°C moisture test requirements. It employs two patented additives that remove and neutralize flux residues from the area between the flip-chip die and substrate, while providing reliable thermal-cycle performance. In the majority of instances, users may forgo post-assembly cleaning processes. For more details, call THE HENKEL GROUP, Industry, CA. (626) 968-6511.