Epoxy System Exhibits High Thermal Conductivity

Oct. 8, 2008
A two part adhesive system, EP21AN specifies a thermal conductivity in excess of 22, dielectric strength greater than 400 V/mil, and a volume resistivity greater than 1,013 Ohm-cm. The adhesive with a non-critical one-to-one mix ratio by weight or

A two part adhesive system, EP21AN specifies a thermal conductivity in excess of 22, dielectric strength greater than 400 V/mil, and a volume resistivity greater than 1,013 Ohm-cm. The adhesive with a non-critical one-to-one mix ratio by weight or volume cures readily at ambient temperatures or more quickly at elevated temperatures. Additionally, it adheres to a wide range of substrates including metals, ceramics, glass, and many plastics. EP21AN is available in half-pint, pint, quart, gallon, and five-gallon kits. MASTER BOND INC., Hackensack, NJ. (201) 343-8983.

Company: MASTER BOND INC.

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