For test, debug, and validation of 0.5-mm pitch BGA devices, the Mod5 Series flip-top BGA socket requires no tooling or mounting holes, maximizing PCB real estate while reducing costs. The component accommodates BGA packages up to 12 mm square (22 x 22 rows) with larger sizes available upon request. Other features include precision machined spring probes offering high bandwidth with very low insertion loss, a SMT design, and metallic probes enabling a spring probe contact system life is 200,000 cycles minimum. ADVANCED INTERCONNECTIONS CORP., West Warwick, RI. (800) 424-9850.
