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BGA Socket Hosts Mobile SDRAM

June 24, 2010
Designed for 1-Gb mobile DDR2-S4 SDRAM with a 0.5-mm pitch in 12 mm x 12 mm, 168 FBGA packages, the SG-BGA-7182 socket specifies a typical contact resistance of 20 m? per I/O.

Designed for 1-Gb mobile DDR2-S4 SDRAM with a 0.5-mm pitch in 12 mm x 12 mm, 168 FBGA packages, the SG-BGA-7182 socket specifies a typical contact resistance of 20 m? per I/O. The socket connects all pins with a 10-GHz bandwidth on all connections and mounts on a PCB with no soldering. It also employs a unique quick-insertion method for changing ICs quickly. For probing memory devices, the socket accommodates Agilent’s Flex Probe stacked inside the socket. Agilent’s probe makes contact with the PCB through the 0.5-mm thick elastomer contact. A memory chip sits on top of the probe and makes contact with it through the elastomer as well. Other features of the socket include an operating temperature range from -35°C to +100°C, a pin self inductance of 0.11 nH, mutual inductance of 0.025 nH, capacitance to ground of 0.01 pF, and a current capacity of 2A per pin. Pricing for the SG-BGA-7182 is $1,543 each. IRONWOOD ELECTRONICS, Burnsville, MN. (800) 404-0204.

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