BGA Socket Supports Processor And Memory

May 12, 2011
The CBT-BGA-7007 triple-stacked BGA socket meets the performance requirements for testing processor and memory simultaneously along with a memory probe.

The CBT-BGA-7007 triple-stacked BGA socket meets the performance requirements for testing processor and memory simultaneously along with a memory probe. The component employs two different spring pin technologies: 0.5-mm pitch stamped spring pins and 0.4-mm pitch etched spring pins. The 0.5mm stamped spring pin has a 26g actuation force per ball and a cycle life of 500,000 insertions. Self inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, capacitance is 0.097pF, and current capacity is 4A at an +80°C temperature rise. The stamped spring pins work between the memory and memory probe as well as between memory probe and processor top. The 0.4mm stamped spring pin has a 34g actuation force per ball and a cycle life of 500,000 insertions. Loop inductance of the contactor is 0.9 nH, insertion loss is less than 1 dB at 9.1 GHz, capacitance is 0.06 pF, and the current capacity is 4A at +60°C temperature rise. Etched spring pins function between processor bottom and the target PCB. Socket temperature range is -55°C to +180°C. Single-unit pricing for the CBT-BGA-7007 is $2,050. IRONWOOD ELECTRONICS, Burnsville, MN. (800) 404-0204.

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