The surface-mount LGA 2011 socket houses Intel’s Core i7 and Xeon 5 CPUs. Its contacts include solder balls for surface mounting and a hex-ball array promises stronger housing and minimizes the space that the solder balls occupy. The socket also sports an integrated lever mechanism that generates the Z-axis compression load and a bolster plate limits PCB bowing during compression. The socket is available in either 15u’’ or 30u’’ gold contact plating. TE Connectivity, Harrisburg, PA. (800) 522-6752.
