Hermetic Packages Suit Military Applications
CPS Technologies offers highly engineered hermetic microelectronic packages, TO-250 type, which can be manufactured in a variety of combinations for military and aerospace electronics. Products consist of a cold rolled steel frame with hermetic seals made with Alloy #52 or Copper Cored Alloy #52 pins in a compression glass seal or ceramic terminal. Bottom choices can be OFHC copper, copper moly, copper tungsten or glidcop. Braze material is 72% Ag / 28% Cu (BT braze). CPS’ plating capabilities include electrolytic nickel per QQ-N-290 and ASTM B-689, electroless nickel per Mil-C-26074E and ASTM B-733, and gold per ASTM B-488 and Mil-G-45205C.
CPS’ test capabilities include air-to-air temperature cycle/shock per MIL-STD-883, method 1010, steam age/solderability testing per MIL-STD-883, method 2003, and lead fatigue per MIL-STD-883, method 2004, They also include hermeticity validation to 1 x 10-10 cc/sec of helium per MIL-STD-883, method 1014, insulation resistance to 10 giga ohms at 500 Vdc per MIL-STD-883, method 1003, and salt spray per MIL-STD-883, method 1009, compliance to JEDEC Std. 9 and Mil-STD-883.
