Caps Employ Low Shrinkage PET Films

The CB Series of Capstick capacitors is fabricated with low-shrinkage PET films, giving the caps increased thermal withstanding capability during reflow soldering. The new plastic film dielectric reduces the chip capÕs tendency to expand and lose capacitance during the pre-heat and reflow cycles. The CB Series now spans a 2 to 10 µF at 100V range and is well-suited for use in telcomm and dc/dc converter applications rated from 20W to 500W. The flame-retardant shell meets telecomm needle flame test requirements while the lead-frame promotes soldering qualities.